Author(s): V. Devender, V. Mahesh, N. Gopikrishna

Email(s): gopikrishna-n@srecwarangal.ac.in

DOI: 10.5958/2321-581X.2018.00012.0   

Address: V. Devender1, V. Mahesh2*, N. Gopikrishna3
1Assistant Profesor in Department of Mechanical Engineering, S R Engineering College, Warangal. Telangana. India
2Profesor at Department of Mechanical Engineering and Principal at S R Engineering College, Warangal. Telangana. India
3Assistant Profesor in Department of Mechanical Engineering, S R Engineering College, Warangal. Telangana. India
*Corresponding Author

Published In:   Volume - 9,      Issue - 1,     Year - 2018


ABSTRACT:
Bulge Testing is a method used to evaluate the mechanical properties, in particular the elastic modulus and residual stress of a thin film. Air pressure is applied to the membrane and the resulting deflection measured with a plunger type dial indicator. This paper work involves in evaluation of mechanical material properties like stress, strain, young’s modulus and poison’s ratio including conduction of various tests with Brass, Rubber and Aluminum sheets which are made in the form of thin films and test those films for determining modulus of rigidity and poison’s ratio.


Cite this article:
V. Devender, V. Mahesh, N. Gopikrishna. Evaluation of Young’s Modulus and Poison’s Ratio using Bulge Test. Research J. Engineering and Tech. 2018;9(1): 75-84 doi: 10.5958/2321-581X.2018.00012.0

Cite(Electronic):
V. Devender, V. Mahesh, N. Gopikrishna. Evaluation of Young’s Modulus and Poison’s Ratio using Bulge Test. Research J. Engineering and Tech. 2018;9(1): 75-84 doi: 10.5958/2321-581X.2018.00012.0   Available on: https://ijersonline.org/AbstractView.aspx?PID=2018-9-1-12


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Author(s): V. Devender, V. Mahesh, N. Gopikrishna

DOI: 10.5958/2321-581X.2018.00012.0         Access: Open Access Read More

Research Journal of Engineering and Technology (RJET) is an international, peer-reviewed, research journal aiming at promoting and publishing original high quality research in all disciplines of engineering sciences and technology....... Read more >>>

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DOI: 10.5958/2321-581X 


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